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MCOB "Multi Chip Cups On Board" | COB "Chip On Board" LED packages the difference between
MCOB "Multi Chip Cups On Board" LED packages
Now the COB "Chip On Board" LEDs package, including the COB packaging technology in Japan, are based on the package substrate. the substrate is in the succession of the N-chips integrated with the package. We all know below the substrate is copper foil. Copper foil can only be good at power conduction, cannot do a very good optical processing.
MCOB is different from traditional package. MCOB "Multi Chip Cups On Board" LEDs package, is put the chip into optical cups directly, not only one cup, but several cups. Based on the optics theory, LED chip just concentrate inside the chip. To make light running out more, need a lot of angles. MCOB package, the efficiency of low-power package must be greater than the high-power package. The high-power chip only has 4 sides light exits. MCOB use small chip into 16 pieces. So the emitting area is 4 x 16 times of the high power chip.
It is No doubt that increase the light exits as many as possible, then efficiency can increase. Meantime, the thermal resistance will be reduced with the cooling area coming large.
MCOB "Multi Chip Cups On Board" package technology breaks through the traditional packaging technology to solve the COB LED light efficiency is low, the problem of slow cooling, while also reducing costs.
COB "Chip On Board" LED packages
LED lighting is a new generation, with energy saving features, but not perfect. Compared with conventional light sources, because of its high luminous intensity per unit area, so a serious glare. When you need a large wattage light source, you need to install more LED stars together, not to mist or haze filter lens case, there will be serious zebra pattern, the use of fog or mist filter lens, the light will bring no small loss.
The core technology uses LED cluster package COB (Chips On Board), makes light-emitting area is increased several times, increasing the power of a single source package, the maximum resolution of the LED light source of the glare problem, the problem zebra and increased efficiency and reduced light resistance, reduce manufacturing costs.
High power LED COB packages (Chip-on Board) are formed by bonding one or several pieces of 40 ~60 mil LED chips to an aluminum based PCB. There are colors available from mono color (cool white, warm white, red, orange, amber, green, blue, etc,) to R/G/B mixed color. Dimension of frequently used aluminum PCB is (15x15mm) and (24x22mm). LED wattage of one single COB package is from 1W to 9W. It is necessary to have COB package mounted onto a suitable heat sink for real application, as considerable amount of heat be generated while LED be turn on.
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